Sn63-Pb 37 Soldering Paste is a soldering material that consists of 63% tin and 37% lead. It is used for soldering electronic components and PCBs.
Features:
• Eutectic composition for precise melting and solidification.
• Excellent wetting and solder joint reliability.
• Suitable for wave soldering and reflow processes.
• Widely used in electronics assembly.
Form | Paste |
Function | Creates A Conductive Bond Between Electronic Components |
Material | Tin (Sn) And Lead (Pb) Alloy |
Color | Grey |
Specifications | Alloy Composition, Melting Point, Shelf Life |
Usage | Soldering Electronic Components On PCBs |
Application | Electronics Assembly |
Storage | Cool, Dry Place |
Temperature Control | Not Applicable |
Safety Features | Easy To Store, Excellent Wetting, Non-Sticky, Cost Effective Etc |
Brand | Various Brands |
Cost | Affordable |
Environmental Considerations | Lead-free Alternatives Available |
Manufacture By | Pratibha Technologies |
Country Of Origin | India |
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